SANTA CLARA, Calif.–(BUSINESS WIRE)–Eliyan Corporation, a leader in high-performance connectivity products and technology for AI and high-performance computing systems, today announced it has secured $50 million in strategic investments from major players across the AI and compute ecosystem, including AMD, Arm, Coherent, and Meta. In addition, existing strategic investors Samsung Catalyst Fund and Intel Capital also participated in the round, reinforcing broad support for Eliyan’s technology roadmap and accelerating commercial momentum.

The participation of these strategic partners represents a strong vote of confidence in Eliyan’s mission to enable scalable, power-efficient computing architectures required for the next wave of AI and advanced computing workloads. As AI systems scale beyond single packages and monolithic modules, interconnect requirements increasingly span both on-package die-to-die links and off-package, chip-to-chip and rack-to-rack connectivity.

This funding marks a key milestone as Eliyan advances the commercialization of its NuLink™ PHY and NuGear™ chiplet families, designed to overcome the memory- and I/O-wall limitations that constrain scalability, power efficiency, and cost in next-generation AI systems.

The NuLink PHY portfolio spans multiple connectivity domains, including:

• Silicon-proven NuLink™ D2D at 64G, deployed and validated more than two years ahead of the broader industry, covering next-generation memory interconnects. This includes the emerging SPHBM4e standard, recently announced by JEDEC, which is capable of supporting next-generation HBM5 bandwidths on standard packaging, further underscoring the company’s ability to execute ahead of industry standardization timelines.
• Next-generation NuLink™ C2C: Next-generation 32G-64Gbps single-ended (NuLink-XS) and 224Gbps differential with emerging 448G (NuLink-XD) SerDes technologies designed for connectivity beyond a package, linking multiple packages, or modules across substrates, boards, or systems. NuLink-X family extends Eliyan’s interconnect solutions to support large-scale, disaggregated AI systems that require extreme bandwidth density at ~2x energy efficiency of alternative solutions.
• NuGear™ chiplet families have been focused on differentiating scale-up network connectivity, targeting 1.6T to 12.8Tbps link bandwidths, addressing the most demanding AI accelerator and memory expansion architectures where latency, power, and reliability constraints dominate system performance when complemented with various optical engines.

Proceeds from the round will be used to accelerate manufacturing and qualification of Eliyan’s next-generation interconnect IP and chiplet products, expand ecosystem partnerships, and support deployment across AI infrastructure, high-performance computing, and edge applications.

“This support from industry leaders who deploy AI infrastructure at massive scale underscores the importance of the innovation Eliyan is driving,” said Ramin Farjadrad, CEO and Co-Founder of Eliyan. “Our silicon-proven 64G D2D leadership, which enables efficient on-package chiplet integration combined with our roadmap for 224G and 448G chip-to-chip interconnect, differentiated scale-up connectivity at 1.6T to 12.8T link bandwidths, and early SPHBM4e silicon proof points extending to future SHHBM5, positions Eliyan to enable the next generation of AI system architectures.”

“The evolution of AI systems increasingly depends on scalable, energy-efficient architectures and strong ecosystem collaboration,” said Mohamed Awad, Executive Vice President, Cloud AI Business Unit, Arm. “Arm is focused on enabling the technologies and partnerships required to support next-generation AI infrastructure at scale.”

“Eliyan is addressing one of the most critical challenges in scaling AI and advanced computing: delivering efficient, high-bandwidth connectivity for chiplet-based architectures,” said Srini Ananth, Managing Director at Intel Capital. “This capability is foundational for the next generation of systems across data center, cloud, and edge markets, and we continue to recognize the value of Eliyan’s approach as they execute on this vision.”

“AI infrastructure is growing at a dramatic pace, accelerating the need for high-performance connectivity technology to scale up compute and memory,” said Dede Goldschmidt, Senior Vice President, Managing Director and Head of Samsung Catalyst Fund. “We are very excited by Eliyan’s momentum since we led their prior round in 2024. The strong investors represented in this new financing round are a testament to the team’s strong execution across the PHY and chiplets businesses.”

About Eliyan

Eliyan Corporation is pioneering the chiplet revolution by providing the industry’s most efficient, scalable interconnect solutions for multi-die architectures. Eliyan’s NuLink™ PHY and associated chiplet offerings deliver high bandwidth and low power in both advanced and standard packaging substrates, enabling chipmakers and systems companies to increase core counts, memory capacity and performance while reducing cost and power. For more information, visit www.eliyan.com.

Contacts

For more information, contact:

Patrick Soheili
+1 650-804-6658
patrick@eliyan.com

Mike Sottak
+1 650-248-9597
mike@wiredislandpr.com

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